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1

Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages

Tong Yan Tee, Hun Shen Ng, Daniel Yap, Zhaowei Zhong

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 268 KB

english, 2003

2

Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications

Tong Yan Tee, Hun Shen Ng, Daniel Yap, Xavier Baraton, Zhaowei Zhong

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 283 KB

english, 2003

3

Dynamic responses and solder joint reliability under board level drop test

Jing-en Luan, Tong Yan Tee, Eric Pek, Chwee Teck Lim, Zhaowei Zhong

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 1.15 MB

english, 2007

4

Board level solder joint reliability analysis of stacked die mixed flip-chip and wirebond BGA

Tong Yan Tee, Hun Shen Ng, Zhaowei Zhong

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 342 KB

english, 2006

5

Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis

Tong Yan Tee, Zhaowei Zhong

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 448 KB

english, 2004

6

Board level solder joint reliability analysis and optimization of pyramidal stacked die BGA packages

Tong Yan Tee, Zhaowei Zhong

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 528 KB

english, 2004

7

[IEEE 2005 7th Electronic Packaging Technology Conference - Singapore (07-09 Dec. 2005)] 2005 7th Electronic Packaging Technology Conference - Silver Glues and Lead-free Alloys in Die Attach of Power Devices

Gobbato, L., Scandurra, A., Tong Yan Tee,

Year:

2005

Language:

english

File:

PDF, 2.68 MB

english, 2005

8

Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill

Tong Yan Tee, Chek Lim Kho, Daniel Yap, Carol Toh, Xavier Baraton, Zhaowei Zhong

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 424 KB

english, 2003

9

[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Advanced Analysis of WLCSP Copper Interconnect Reliability under Board Level Drop Test

Tee, Tong Yan, Tan, Long Bin, Anderson, Rex, Ng, Hun Shen, Low, Jim Hee, Khoo, Choong Peng, Moody, Robert, Rogers, Boyd

Year:

2008

Language:

english

File:

PDF, 11.45 MB

english, 2008

10

[IEEE 2005 7th Electronic Packaging Technology Conference - Singapore (07-09 Dec. 2005)] 2005 7th Electronic Packaging Technology Conference - Study of PCB Strains and Component Position Under Board Level Drop Test

Fong Kuan Ng,, Chwee Teck Lim,, Pek, E., Jing-En Luan,, Tong Yan Tee,

Year:

2005

Language:

english

File:

PDF, 5.40 MB

english, 2005

11

[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Fine pitch Cu pillar wafer process development and seed layer etching characterization

Li Yan Siow,, Wei Deng,, Qing Xin Zhang,, Tai Chong Chai,, Chee Guan Koh,, Witarsa, D., Xianfeng Wang,, Hongqi Sun,, Ando, T., Tong Yan Tee,, Wong, J.

Year:

2012

Language:

english

File:

PDF, 1.29 MB

english, 2012

12

[IEEE 2005 7th Electronic Packaging Technology Conference - Singapore (07-09 Dec. 2005)] 2005 7th Electronic Packaging Technology Conference - Investigating the Cyclic Bending of PCB Subassembly During Board Level Drop Test

Pek, E., Chwee Teck Lim,, Tong Yan Tee,, Jing-en Luan,, Tan, V.B.C.

Year:

2005

Language:

english

File:

PDF, 4.93 MB

english, 2005

13

[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Comparative electromigration performance of Pb Free flip chip joints with varying board surface condition

Nicholls, Lou, Darveaux, Robert, Syed, Ahmer, Loo, Shane, Tee, Tong Yan, Wassick, Thomas A., Batchelor, Bill

Year:

2009

Language:

english

File:

PDF, 927 KB

english, 2009

14

[IEEE 2004 54th Electronic Components and Technology Conference - Las Vegas, NV, USA (1-4 June 2004)] 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) - Advanced experimental and simulation techniques for analysis of dynamic responses during drop impact

Tong Yan Tee,, Jing-en Luan,, Pek, E., Chwee Teck Lim,, Zhaowei Zhong,

Year:

2004

Language:

english

File:

PDF, 840 KB

english, 2004

15

Numerical and experimental correlation of high temperature reliability of gold wire bonding to intermetallics (Au/Al) uniformity

Xueren Zhang, Tong Yan Tee

Journal:

Thin Solid Films

Year:

2006

Language:

english

File:

PDF, 577 KB

english, 2006

16

Advances in Wafer Level Packaging (WLP)

Tong Yan Tee, Xuejun Fan, Yi-Shao Lai

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 102 KB

english, 2010

17

Advanced analysis on board trace reliability of WLCSP under drop impact

Ahmer Syed, Tong Yan Tee, Hun Shen Ng, Rex Anderson, Choong Peng Khoo, Boyd Rogers

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 1.63 MB

english, 2010

18

[IEEE Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) - Singapore (8-10 Dec. 2004)] Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) - Design for standard impact pulses of drop tester using dynamic simulation

Hun Shen Ng,, Tong Yan Tee,, Jing-en Luan,

Year:

2004

Language:

english

File:

PDF, 462 KB

english, 2004

19

Impact life prediction modeling of TFBGA packages under board level drop test

Tong Yan Tee, Hun Shen Ng, Chwee Teck Lim, Eric Pek, Zhaowei Zhong

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 487 KB

english, 2004

20

[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - Board level drop test and simulation of TFBGA packages for telecommunication applications

Tong Yan Tee,, Hun Shen Ng,, Chwee Teck Lim,, Pek, E., Zhaowei Zhong,

Year:

2003

Language:

english

File:

PDF, 811 KB

english, 2003

21

[IEEE 4th Electronics Packaging Technology Conference (EPTC 2002) - Singapore (10-12 Dec. 2002)] 4th Electronics Packaging Technology Conference, 2002. - Design analysis of solder joint reliability for stacked die mixed flip-chip and wirebond BGA

Tee Tong Yan,, Mayhuan Lim,, Ng Hun Shen,, Baraton, X., Kaire, D., Zhong Zhaowei,

Year:

2002

Language:

english

File:

PDF, 812 KB

english, 2002

22

[IEEE 2005 7th Electronic Packaging Technology Conference - Singapore (07-09 Dec. 2005)] 2005 7th Electronic Packaging Technology Conference - Effects of Thermal, Moisture and Mechanical Loading Conditions on Interfacial Fracture Toughness using Brazil-nut Specimens

Loo, S., Mhaisalkar, S., Xueren Zhang,, Hun Shen Ng,, Tong Yan Tee,

Year:

2005

Language:

english

File:

PDF, 3.81 MB

english, 2005

23

[IEEE International Symposium on Electronic Materials and Packaging (EMAP2000) - Hong Kong, China (30 Nov.-2 Dec. 2000)] International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) - Board level solder joint reliability modeling of LFBGA package

Tong Yan Tee,, Sivakumar, K., Do-Bento-Vieira, A.

Year:

2000

Language:

english

File:

PDF, 402 KB

english, 2000

24

[IEEE 2005 6th International Conference on Electronics Packaging Technology - Shenzhen, China (30 Aug.-2 Sept. 2005)] 2005 6th International Conference on Electronic Packaging Technology - Comprehensive Warpage Analysis of Stacked Die MEMS Package in Accelerometer Application

Xueren Zhang,, Tong Yan Tee,, Jing-en Luan,

Year:

2005

Language:

english

File:

PDF, 505 KB

english, 2005

25

[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - Absolute and relative fatigue life prediction methodology for virtual qualification and design enhancement of lead-free BGA

Hun Shen Ng,, Tong Yan Tee,, Kim Yong Goh,, Jing-en Luan,, Reinikainen, T., Hussa, E., Kujala, A.

Year:

2005

Language:

english

File:

PDF, 686 KB

english, 2005

26

[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Whole-field board strain and displacement characterization during drop impact using a single camera DIC technique

De Lim, Fabian Zhi, Tan, Long Bin, Quan, Chenggen, Tee, Tong Yan

Year:

2009

Language:

english

File:

PDF, 635 KB

english, 2009

27

[IEEE 2005 7th Electronic Packaging Technology Conference - Singapore (07-09 Dec. 2005)] 2005 7th Electronic Packaging Technology Conference - Drop Impact Life Prediction Model for Wafer Level Chip Scale Packages

Kim Yong Goh,, Jing-en Luan,, Tong Yan Tee,

Year:

2005

Language:

english

File:

PDF, 4.41 MB

english, 2005

28

[IEEE 2005 6th International Conference on Electronics Packaging Technology - Shenzhen, China (30 Aug.-2 Sept. 2005)] 2005 6th International Conference on Electronic Packaging Technology - Analysis of PCB subassembly dynamic responses using integrated analytical, numerical and experimental techniques

Jing-en Luan,, Tong Yan Tee,

Year:

2005

Language:

english

File:

PDF, 634 KB

english, 2005

29

Errata

Jing-en Luan,, Tong Yan Tee,

Journal:

IEEE Electron Device Letters

Year:

1982

Language:

english

File:

PDF, 80 KB

english, 1982

30

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Development of low-cost wafer level package through integrated design and simulation analysis

Tee, Tong Yan, Siew, Glen, Chen, Haoyang, Soh, Serine, Kang, In Soo, Kim, Jong Heon, Lee, Teck Kheng, Ser, Bok Leng, Ng, Hun Shen, Hoe, Germaine, Gao, Shan

Year:

2011

Language:

english

File:

PDF, 4.55 MB

english, 2011

31

[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Rate-dependent properties of Sn-Ag-Cu based lead free solder joints

Su, Yong'An, Tan, Long Bin, Tan, Vincent B.C., Tee, Tong Yan

Year:

2009

Language:

english

File:

PDF, 1.09 MB

english, 2009

32

[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - SMT process robustness and board level solder joint reliability of C/sup 2/BGA

Tiao Zhou,, Villa, C.M., Tong Yan Tee,, Haibin Du,

Year:

2003

Language:

english

File:

PDF, 397 KB

english, 2003

33

[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Prototyping of low-cost wafer level packages

Chen, Haoyang, Tee, Tong Yan, Siew, Glen, Soh, Serine, Kang, In Soo, Kim, Jong Heon, Lee, Teck Kheng, Ser, Bok Leng, Ng, Hun Shen, Hoe, Germaine, Gao, Shan

Year:

2011

Language:

english

File:

PDF, 1.72 MB

english, 2011

34

[IEEE 2005 6th International Conference on Electronics Packaging Technology - Shenzhen, China (30 Aug.-2 Sept. 2005)] 2005 6th International Conference on Electronic Packaging Technology - Effect of unfilled underfill on drop test and thermal cycle reliability

Ibe, E.S., Loh, K.I., Jing-en Luan,, Tong Yan Tee,

Year:

2005

Language:

english

File:

PDF, 635 KB

english, 2005

35

Impact of Thermal, Moisture, and Mechanical Loading Conditions on Interfacial Fracture Toughness of Adhesively Bonded Joints

Shane Loo, Xueren Zhang, Hun Shen Ng, Tong Yan Tee, S. G. Mhaisalkar

Journal:

Journal of Electronic Materials

Year:

2007

Language:

english

File:

PDF, 454 KB

english, 2007

36

[IEEE 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Singapore, Singapore (2010.12.7-2010.12.9)] 2010 IEEE Electrical Design of Advanced Package & Systems Symposium - Effect of ground plane design for WLP with signal integrity modeling and analysis

Siew, Glen, Yan, Tee Tong, Haoyang, Chen, Soh, Serine, Heon, Kim Jong

Year:

2010

File:

PDF, 631 KB

2010

37

[IEEE EuroSimE 2005. 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Berlin, Germany (April 18-20, 2005)] EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Drop impact life prediction model for lead-free BGA packages and modules

Jing-en Luan,, Tong Yan Tee,, Kim Yong Goh,, Hun Shen Ng,, Baraton, X., Brenner, R., Sorricul, M.

Year:

2005

Language:

english

File:

PDF, 1.34 MB

english, 2005

38

[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - Effect of impact pulse parameters on consistency of board level drop test and dynamic responses

Jing-en Luan,, Tong Yan Tee,

Year:

2005

Language:

english

File:

PDF, 641 KB

english, 2005

39

[IEEE 5th Electronics Packaging Technology Conference (EPTC 2003) - Singapore (10-12 Dec. 2003)] Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) - Modal analysis and dynamic responses of board level drop test

Jing-en Luan,, Tong Yan Tee,, Pek, E., Chwee Teck Lim,, Zhaowei Zhong,

Year:

2003

Language:

english

File:

PDF, 828 KB

english, 2003

40

[IEEE 52nd Electronic Components and Technology Conference - San Diego, CA, USA (28-31 May 2002)] 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) - Comprehensive design analysis of QFN and PowerQFN packages for enhanced board level solder joint reliability

Tong Yan Tee,, Hun Shen Ng,, Diot, J.-L., Frezza, G., Tiziani, R., Santospirito, G.

Year:

2002

Language:

english

File:

PDF, 752 KB

english, 2002

41

[IEEE 6th Electronics Packaging Technology Conference (EPTC 2004) - Singapore (8-10 Dec. 2004)] Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) - Novel board level drop test simulation using implicit transient analysis with input-G method

Jing-en Luan,, Tong Yan Tee,

Year:

2004

Language:

english

File:

PDF, 455 KB

english, 2004

42

[IEEE 52nd Electronic Components and Technology Conference - San Diego, CA, USA (28-31 May 2002)] 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) - Whole field vapor pressure modeling of QFN during reflow with coupled hygro-mechanical and thermo-mechanical stresses

Tong Yan Tee,, Hun Shen Ng,

Year:

2002

Language:

english

File:

PDF, 884 KB

english, 2002

43

[IEEE Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) - Singapore (8-10 Dec. 2004)] Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) - Design analysis of touch chip for enhanced package and board level reliability

Tong Yan Tee,, Hun Shen Ng,, Siegel, H., Bond, R., Zhaowei Zhong,

Year:

2004

Language:

english

File:

PDF, 342 KB

english, 2004

44

[IEEE 2009 10th International Conferene on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Delft, The Netherlands (2009.04.26-2009.04.29)] EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Design for board trace reliability of WLCSP under drop test

Tee, Tong Yan, Ng, Hun Shen, Syed, Ahmer, Anderson, Rex, Khoo, Choong Peng, Rogers, Boyd

Year:

2009

Language:

english

File:

PDF, 21.94 MB

english, 2009

45

[IEEE 6th Electronics Packaging Technology Conference (EPTC 2004) - Singapore (8-10 Dec. 2004)] Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) - Nonlinear elasto-plastic analysis of wire bond reliability for optical LQFP package

Xueren Zhang,, Tong Yan Tee,, Cachia, C.

Year:

2004

Language:

english

File:

PDF, 338 KB

english, 2004

46

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Electrical simulation and measurement of IPD with multilayer thin film technology for WLP

Siew, Glen, Soh, Serine, Tee, Tong Yan, Chen, Haoyang, Kang, In Soo, Kim, Jong Heon

Year:

2011

Language:

english

File:

PDF, 4.49 MB

english, 2011

47

[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - Development and application of innovational drop impact modeling techniques

Tong Yan Tee,, Jing-en Luan,, Hun Shen Ng,

Year:

2005

Language:

english

File:

PDF, 636 KB

english, 2005

48

[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - Advanced Reliability Modeling of Cu/low-k Interconnection in FCBGA Package

Fiori, V., Xueren Zhang,, Tong Yan Tee,

Year:

2006

Language:

english

File:

PDF, 964 KB

english, 2006

49

[IEEE Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems - EuroSimE 2004 - Brussels, Belgium (10-12 May 2004)] 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the - Novel numerical and experimental analysis of dynamic responses under board level drop test

Tong Yan Tee,, Jing-en Luan,, Pek, E., Chwee Teck Lim,, Zhaowei Zhong,

Year:

2004

Language:

english

File:

PDF, 1.15 MB

english, 2004

50

[IEEE 2005 6th International Conference on Electronics Packaging Technology - Shenzhen, China (30 Aug.-2 Sept. 2005)] 2005 6th International Conference on Electronic Packaging Technology - Solder joint failure modes, mechanisms, and life prediction models of IC packages under board level drop impact

Jing-en Luan,, Tong Yan Tee,, Xueren Zhang,, Hussab, E.

Year:

2005

Language:

english

File:

PDF, 2.68 MB

english, 2005

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